Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/14/2015
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Application #:
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13522753
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Filing Dt:
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07/18/2012
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Publication #:
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Pub Dt:
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11/22/2012
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Inventors:
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Takahiko Wada, Takuma Hirayama
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Title:
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INSPECTION OF BALL GRID ARRAY SOLDERING WITH BOUNDARY DETECTION USING TOMOGRAPHIC ARTIFACT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-7, NAKANOBU, SHINAGAWA-KU |
| TOKYO, JAPAN 142-0053 |
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| LADAS & PARRY LLP |
| 1040 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10018-3738 |
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