Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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13266945
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Filing Dt:
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10/28/2011
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Publication #:
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Pub Dt:
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12/13/2012
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Inventor:
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Naoki Kohda
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Title:
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ELECTRONIC COMPONENT PACKAGE SEALING MEMBER, ELECTRONIC COMPONENT PACKAGE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE SEALING MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1389, AZA-KONO, SHINZAIKE, HIRAOKA-CHO, |
| KAKOGAWA-SHI, HYOGO, JAPAN 675-0194 |
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| MOTS LAW, PLLC |
| 1629 K STREET N.W. |
| SUITE 200 |
| WASHINGTON, DC 20006-1635 |
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