Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13168158
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Filing Dt:
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06/24/2011
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Publication #:
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Pub Dt:
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12/27/2012
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Inventors:
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Roden R. Topacio, I-Tseng Lee
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Title:
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SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE, PO BOX 3453 |
| KEVIN A. O'NEIL |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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| TIMOTHY M. HONEYCUTT |
| PO BOX 1577 |
| CYPRESS, TX 77410-1577 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 COMMERCE VALLEY DR. EAST |
| KEVIN O'NEIL |
| MARKHAM, CANADA L3T 7X6 |
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| TIMOTHY M HONEYCUTT ATTORNEY AT LAW |
| P O BOX 1577 |
| CYPRESS, TX 77410 |
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