Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13166679
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Filing Dt:
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06/22/2011
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Publication #:
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Pub Dt:
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12/27/2012
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Inventors:
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HyungMin Lee, HeeJo Chi, YeongIm Park
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| LAW OFFICES OF MIKIO ISHIMARU |
| 2055 GATEWAY PLACE |
| SUITE 700 |
| SAN JOSE, CA 95110 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| ATTENTION: AGENCY AND TRUST |
| CENTRAL, HONG KONG |
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| LAWRENCE KASS |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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