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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/04/2015
Application #:
13535655
Filing Dt:
06/28/2012
Publication #:
Pub Dt:
01/03/2013
Inventors:
Kevin D. Wissner, Edward A. Novack
Title:
PACKAGING OF POWER SUPPLY USING MODULAR ELECTRONIC MODULES
Assignment: 1
Reel/Frame:
028810/0639Recorded: 08/20/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/26/2012
Exec Dt:
07/26/2012
Assignee:
3333 OLD MILTON PARKWAY
ALPHARETTA, GEORGIA 30005
Correspondent:
SANDRA BAKER
170 WOOD AVENUE SOUTH
IPD 5TH FLOOR
ISELIN, NJ 08830
Assignment: 2
Reel/Frame:
035524/0964Recorded: 04/28/2015Pages: 26
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/12/2014
Assignee:
WITTELSBACHERPLATZ 2
MUNICH, GERMANY 80333
Correspondent:
SIEMENS CORPORATION
INTELLECTUAL PROPERTY DEPT
3501 QUADRANGLE BLVD STE 230
ORLANDO, FL 32817
Assignment: 3
Reel/Frame:
065612/0733Recorded: 11/17/2023Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/07/2023
Assignee:
VOGELWEIHERSTRASSE 1-15
NÜRNBERG, GERMANY 90441
Correspondent:
SIEMENS CORPORATION
3850 QUADRANGLE BOULEVARD
IP DEPT - MAIL CODE INT - 244
ORLANDO, FL 32817

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