Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13530542
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Filing Dt:
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06/22/2012
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Publication #:
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Pub Dt:
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01/03/2013
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Inventors:
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Shun Kayama, Yukiko Shimizu, Atsuhide Hanyu, Susumu Hoshino, Keisuke Kawamura
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Title:
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MOLDING APPARATUS, METHOD OF FORMING MOLDED PRODUCT, AND MOLDED PRODUCT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-1 KONAN, MINATO-KU |
| TOKYO |
| 108-0075, JAPAN |
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| DENNIS M. SMID, ESQ. |
| LERNER, DAVID ET AL. |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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