Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13172161
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Filing Dt:
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06/29/2011
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Publication #:
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Pub Dt:
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01/03/2013
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Inventors:
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Krishnendu Chakrabarty, Brandon Noia
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Title:
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METHOD AND ARCHITECTURE FOR PRE-BOND PROBING OF TSVs IN 3D STACKED INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OFFICE OF SCIENCE AND TECHNOLOGY |
| DURHAM, NORTH CAROLINA 27710 |
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| SARAH J. KNIGHT |
| PO BOX 142950 |
| GAINESVILLE, FL 32614-2950 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 2415 EISENHOWER AVENUE |
| ROOM W 18000 |
| ALEXANDRIA, VIRGINIA 22314 |
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| NATIONAL SCIENCE FOUNDATION |
| 2415 EISENHOWER AVENUE |
| ROOM W 18000 |
| ALEXANDRIA, VA 22314 |
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