Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13348308
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Filing Dt:
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01/11/2012
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Publication #:
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Pub Dt:
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01/10/2013
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Inventors:
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Anthony C. Tsui, Hongbo Yang, Ming Zhou, Weibing Chu, Anthony Chia
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Title:
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SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2880 LAKESIDE DRIVE |
| SUITE 205 |
| SANTA CLARA, CALIFORNIA 95054 |
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| SCOTT L. MCMILLAN |
| TWO EMBARCADERO CENTER, EIGHTH FLOOR |
| KILPATRICK TOWNSEND & STOCKTON LLP |
| SAN FRANCISCO, CA 94111-3834 |
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