Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/30/2013
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Application #:
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13183272
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Filing Dt:
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07/14/2011
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Publication #:
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Pub Dt:
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01/17/2013
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Inventors:
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Ulrich Krumbein, Gerhard Lohninger, Alfons Dehe
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Title:
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SYSTEM AND METHOD FOR WAFER LEVEL PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON RD. |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4600 SILICON DRIVE |
| DURHAM, NORTH CAROLINA 27703 |
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| CHARLES A. JACOBSON |
| 4600 SILICON DRIVE |
| DURHAM, NC 27703 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 214 N. TRYON STREET, 27TH FLOOR |
| MAIL CODE CN-NC-H27A |
| CHARLOTTE, NORTH CAROLINA 28202 |
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| NIKOLAI DOKKEDAHL |
| 1285 AVENUE OF THE AMERICAS |
| PAUL WEISS RIFKIND WHARTON &GARRISON LLP |
| NEW YORK, NY 10019-6064 |
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