Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/08/2016
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Application #:
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13184675
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Filing Dt:
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07/18/2011
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Publication #:
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Pub Dt:
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01/24/2013
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Inventors:
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Shu Chuen HO, Kai Fat YIP, Eng Cheng CHNG, Yew Lan NGO, Saravana Ranganathan DAMODARAN
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Title:
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APPARATUS FOR ELECTROPLATING A TOOLING FOR USE IN SEMICONDUCTOR DEVICE ENCAPSULATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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OSTROLENK FABER LLP |
1180 AVENUE OF THE AMERICAS |
7TH FLOOR |
NEW YORK, NY 10036 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE TO: ASM TECHNOLOGY SINGAPORE PTE LTD. "SINGAPORE" PREVIOUSLY OMITTED PREVIOUSLY RECORDED ON REEL 026805 FRAME 0738. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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OSTROLENK FABER LLP |
1180 AVENUE OF THE AMERICAS |
7TH FLOOR |
NEW YORK, NY 10036 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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2 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768924 |
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CPA GLOBAL |
CASTLE STREET , LIBERATION HOUSE |
ST HELIER, JERSEY, JE1 1BL JERSEY |
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