Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13421388
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Filing Dt:
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03/15/2012
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Publication #:
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Pub Dt:
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01/24/2013
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Inventors:
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Eun-Ji Jung, Tsukasa Matsuda, Jongho Yun, Jongjin Lee, Gilheyun Choi, Seung-Wook Choi
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Title:
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MICROELECTRONIC DEVICES INCLUDING THROUGH SILICON VIA STRUCTURES HAVING POROUS LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MYERS BIGEL SIBLEY & SAJOVEC/KSC |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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