Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13243021
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Filing Dt:
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09/23/2011
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Publication #:
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Pub Dt:
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01/31/2013
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Inventors:
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Wei-Chung Hsiao, Chun- Hsien Lin, Yu-Cheng Pai, Liang-Yi Hung, Ming-Chen Sun
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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