Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13556646
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Filing Dt:
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07/24/2012
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Publication #:
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Pub Dt:
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01/31/2013
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Inventors:
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Tomohito IWASHIGE, Tomoaki ICHIKAWA, Naoya SUGIMOTO, Mitsuaki FUSUMADA
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Title:
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EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE. NW |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9, SHIBA DAIMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8518 |
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| 1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI |
| OSAKA, JAPAN 567-0041 |
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| ALAN E. SCHIAVELLI |
| 700 12TH STREET NW, SUITE 700 |
| WASHINGTON, DC 20005 |
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Assignment:
3
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| 9-1, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-7325 |
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| ALAN E. SCHIAVELLI |
| SUITE 2100 |
| 120 SOUTH LASALLE STREET |
| CHICAGO, IL 60603 |
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