Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13646249
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Filing Dt:
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10/05/2012
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Publication #:
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Pub Dt:
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01/31/2013
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Inventors:
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Mario Cortese, Mark A. Azzopardi, Kun-Chen Tsai, Shih-Ping Hsu, Ivan Micallef
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Title:
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LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VIA C. OLIVETTI, 2 |
| AGRATE BRIANZA, ITALY 20864 |
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| NO. 38, HSING PONG RD., KWEI-SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN 333 |
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| KAREN M. HENCKEL |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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