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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/04/2014
Application #:
13647052
Filing Dt:
10/08/2012
Publication #:
Pub Dt:
02/07/2013
Inventors:
Gabriel Wong, Roden Topacio
Title:
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
Assignment: 1
Reel/Frame:
050194/0206Recorded: 08/28/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/14/2011
Exec Dt:
06/14/2011
Assignee:
ONE COMMERCE VALLEY DRIVE EAST
MARKHAM, ONTARIO, CANADA L3T 7X6
Correspondent:
CHRISTOPHER J. RECKAMP
311 S. WACKER DRIVE
FAEGRE BAKER DANIELS LLP
CHICAGO, IL 60606

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