Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13418134
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Filing Dt:
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03/12/2012
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Publication #:
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Pub Dt:
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02/07/2013
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Inventors:
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Koichi MEGURO, Kanji Otsuka
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Title:
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WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NKF BLDG. 4TH FLOOR, 1-2 HIGASIDA-CHO, KAWASAKIKU, KANAGAWA |
| KAWASAKI-SHI, JAPAN 2100005 |
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| SILICON VALLEY PATENT GROUP LLP |
| 4010 MOORPARK AVENUE |
| SUITE 210 |
| SAN JOSE, CA 95117 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-11 OMORI-KITA 2-CHOME, OTA-KU |
| TOKYO, JAPAN 1438580 |
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| SILICON VALLEY PATENT GROUP LLP |
| 4010 MOORPARK AVENUE |
| SUITE 210 |
| SAN JOSE, CA 95117 |
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