Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/31/2013
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Application #:
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13206280
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Filing Dt:
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08/09/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Inventors:
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Mariam Sadaka, Bich-Yen Nguyen
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Title:
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METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES IN 3D INTEGRATION PROCESSES USING RECOVERABLE SUBSTRATES, AND BONDED SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS
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Assignment:
1
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DES FRANGUES |
| PARC TECHNOLOGIQUE DES FONTAINES |
| BERNIN, FRANCE 38190 |
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| TRASKBRITT |
| P.O. BOX 2550 |
| SALT LAKE CITY, UT 84110-2550 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHEMIN DES FRANQUES |
| PARC TECHNOLOGIQUE DES FONTAINES |
| BERNIN, FRANCE 38190 |
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| TRASKBRITT |
| P.O. BOX 2550 |
| SALT LAKE CITY, UT 84110 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-14-1 ASAHI-CHO |
| ATSUGI-SHI, KANAGAWA, JAPAN |
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| DANIEL M. GURFINKEL |
| DENNEMEYER & ASSOCIATES, LLC |
| 2 NORTH RIVERSIDE PLAZA, SUITE 1500 |
| CHICAGO, IL 60606 |
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