Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2017
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Application #:
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13642517
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Filing Dt:
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10/19/2012
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Publication #:
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Pub Dt:
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02/14/2013
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Inventors:
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Dejun Wang, Wangjun Zhang, Haode Jiang
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Title:
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Double-Layer Injection Molding Casing and Method for Manufacturing the Same,Electronic Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 151 ZHUZHOU ROAD, LAOSHAN ZONE |
| QINGDAO CITY, SHANDONG PROVINCE, CHINA 266100 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 218 QIANWANGANG ROAD, ECONOMIC AND TECHNICAL DEVELOPMENT ZONE |
| QINGDAO CITY, SHANDONG PROVINCE, CHINA 266555 |
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| CHENG-JU CHIANG |
| P.O. BOX 766 |
| CHINO, CA 91708 |
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