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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/14/2015
Application #:
13212834
Filing Dt:
08/18/2011
Publication #:
Pub Dt:
02/21/2013
Inventors:
Gin-Chen Huang, Tsai-Fu Hsiao, Ching-Hong Jiang, Neng-Kuo Chen, Hongfa Luan et al
Title:
Semiconductor Device Manufacturing Methods and Methods of Forming Insulating Material Layers
Assignment: 1
Reel/Frame:
026774/0127Recorded: 08/18/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/11/2011
Exec Dt:
08/11/2011
Exec Dt:
08/12/2011
Exec Dt:
08/11/2011
Exec Dt:
08/11/2011
Exec Dt:
08/12/2011
Exec Dt:
08/17/2011
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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