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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/10/2015
Application #:
13662307
Filing Dt:
10/26/2012
Publication #:
Pub Dt:
02/28/2013
Inventors:
Christopher Rosenthal, Gregory George
Title:
Debonding Temporarily Bonded Semiconductor Wafers
Assignment: 1
Reel/Frame:
029819/0873Recorded: 02/15/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/13/2013
Exec Dt:
02/15/2013
Assignee:
430 INDIO WAY
SUNNYVALE, CALIFORNIA 94085
Correspondent:
PAUL A. SMITH
FENWICK & WEST LLP
801 CALIFORNIA STREET
MOUNTAIN VIEW, CA 94041
Assignment: 2
Reel/Frame:
032328/0153Recorded: 02/28/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/26/2014
Assignee:
SCHLEISSHEIMER STR. 90
GARCHING, GERMANY 85748
Correspondent:
PAUL A. SMITH
FENWICK & WEST LLP
801 CALIFORNIA STREET
MOUNTAIN VIEW, CA 94041

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