Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13218352
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Filing Dt:
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08/25/2011
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Publication #:
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Pub Dt:
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02/28/2013
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Inventors:
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David B. Kerwin, Joseph Benedetto
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Title:
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WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4350 CENTENNIAL BLVD. |
COLORADO SPRINGS, COLORADO 80907-3486 |
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HOGAN LOVELLS US LLP |
ONE TABOR CENTER |
1200 17TH STREET, SUITE 1500 |
DENVER, CO 80202 |
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Assignment:
2
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277 PARK AVENUE, 23RD FLOOR |
NEW YORK, NEW YORK 10172 |
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ELAINE CARRERA, LEGAL ASSISTANT |
80 PINE STREET |
NEW YORK, NY 10005 |
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