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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/01/2014
Application #:
13594217
Filing Dt:
08/24/2012
Publication #:
Pub Dt:
02/28/2013
Inventor:
Masahisa WATANABE
Title:
TRENCH FILLING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Assignment: 1
Reel/Frame:
028853/0562Recorded: 08/27/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/21/2012
Assignee:
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO, JAPAN 107-6325
Correspondent:
NATH, GOLDBERG & MEYER
112 S. WEST STREET
ALEXANDRIA, VA 22314

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