Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13640540
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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03/07/2013
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Inventors:
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Hidetsugu Namiki, Akira Ishigami, Hideaki Umakoshi, Shiyuki Kanisawa
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Title:
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CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GATE CITY OSAKI, EAST TOWER 8F. |
| 1-11-2, OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| T. CHYAU LIANG |
| 909 FANNIN |
| SUITE 3500 |
| HOUSTON, TX 77010 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| GATE CITY OSAKI, EAST TOWER 8F. |
| 1-11-2 OSAKI, SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| JONATHAN P. OSHA |
| TWO HOUSTON CENTER |
| 909 FANNIN, SUITE 3500 |
| HOUSTON, TX 77010 |
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