Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13670356
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Filing Dt:
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11/06/2012
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Publication #:
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Pub Dt:
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03/07/2013
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Inventors:
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Takashi Shinoda, Kazuhiro Enomoto, Toshiaki Akutsu
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Title:
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CMP POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 163-0449 |
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| GRIFFIN & SZIPL, P.C. |
| 2300 9TH STREET SOUTH |
| SUITE PH-1 |
| ARLINGTON, VA 22204 |
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