Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/12/2020
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Application #:
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13606147
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Filing Dt:
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09/07/2012
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Publication #:
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Pub Dt:
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03/14/2013
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Inventor:
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Diann-Fang LIN
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Title:
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CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 118, CHUNG-HUA RD., CHU-NAN |
MIAO-LI, TAIWAN |
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LOWE HAUPTMAN HAM & BERNER, LLP |
1700 DIAGONAL ROAD |
SUITE 300 |
ALEXANDRIA, VA 22314 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO.81, SEC. 2, GONGDAO 5TH RD. |
PUDING VIL., EAST DIST. |
HSINCHU CITY, TAIWAN 30070 |
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KING YUAN ELECTRONICS CO., LTD. |
NO.81, SEC. 2, GONGDAO 5TH RD. |
PUDING VIL., EAST DIST. |
HSINCHU CITY, 30070 TAIWAN |
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