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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/24/2015
Application #:
13327491
Filing Dt:
12/15/2011
Publication #:
Pub Dt:
03/14/2013
Inventor:
Diann-Fang Lin
Title:
METHOD FOR MANUFACTURING A CHIP PACKAGING STRUCTURE
Assignment: 1
Reel/Frame:
027391/0174Recorded: 12/15/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/02/2011
Assignee:
NO. 118, CHUNG-HUA RD., CHU-NAN
MIAO-LI, TAIWAN
Correspondent:
MORRIS MANNING MARTIN LLP
3343 PEACHTREE ROAD, NE
1600 ATLANTA FINANCIAL CENTER
ATLANTA, GA 30326
Assignment: 2
Reel/Frame:
048567/0463Recorded: 03/11/2019Pages: 8
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/01/2018
Assignee:
NO.81, SEC. 2, GONGDAO 5TH RD.
PUDING VIL., EAST DIST.
HSINCHU CITY, TAIWAN 30070
Correspondent:
JONATHAN P SOIFER
SANDBERG PHOENIX & VON GONTARD, P.C.
120 S. CENTRAL AVE., SUITE 1600
CLAYTON, MO 63105

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