Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/03/2017
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Application #:
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13637216
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Filing Dt:
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11/27/2012
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Publication #:
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Pub Dt:
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03/14/2013
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Inventors:
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Hiroyuki Morita, Hiroshi Yamauchi, Hiroshi Natsui
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Title:
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THERMALLY EXPANDABLE MICROCAPSULE, METHOD FOR PRODUCING THERMALLY EXPANDABLE MICROCAPSULE, FOAMABLE MASTERBATCH, AND FOAM MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI, |
| OSAKA, JAPAN 530-8565 |
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| WENDEROTH, LIND & PONACK, LLP |
| 1030 15TH STREET, N.W. |
| SUITE 400 EAST |
| OSAKA, 530-8565 JAPAN |
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