Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/10/2014
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Application #:
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13639847
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Filing Dt:
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12/12/2012
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Publication #:
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Pub Dt:
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03/28/2013
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Inventors:
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Wei Wang, Zhengxun Liu
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Title:
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GRINDING/ELECTROLYSIS COMBINED MULTI-WIRE-SLICING PROCESSING METHOD FOR SILICON WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29 YUDAO ST. BAIXIA NANJING |
| JIANGSU 210016, CHINA |
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| CHRISTIE, PARKER & HALE, LLP |
| PO BOX 29001 |
| GLENDALE, CA 91209 |
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