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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/27/2013
Application #:
13302077
Filing Dt:
11/22/2011
Publication #:
Pub Dt:
03/28/2013
Inventors:
YuPing Gong, Yan Xun Xue, Liang Zhao
Title:
SEMICONDUCTOR PACKAGE OF SMALL FOOTPRINT WITH A STACK OF LEAD FRAME DIE PADDLE SANDWICH BETWEEN HIGH-SIDE AND LOW-SIDE MOSFETS AND MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
027272/0255Recorded: 11/22/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/21/2011
Exec Dt:
11/18/2011
Exec Dt:
11/21/2011
Assignee:
475 OAKMEAD PKWY
SUNNYVALE, CALIFORNIA 94085
Correspondent:
CHEIN-HWA S. TSAO
6684 MT PAKRON DRIVE
SAN JOSE, CA 95120

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