Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2013
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Application #:
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13240048
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Filing Dt:
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09/22/2011
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Publication #:
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Pub Dt:
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03/28/2013
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Inventors:
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Hiroyuki ITO, Yoshitaka SASAKI, Atsushi IIJIMA
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Title:
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COMPOSITE LAYERED CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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| 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK |
| SHATIN, N.T. HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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