Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13339736
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Filing Dt:
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12/29/2011
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Publication #:
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Pub Dt:
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03/28/2013
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Inventors:
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Yuwen Chen, Qiang Xu, Chunsheng Zheng, Wenguang Zhang
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Title:
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Method for Fabricating Copper Interconnections in an Ultra Low Dielectric Constant Film
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 497 GAO SI ROAD |
| ZHANGJIANG HI-TECH PARK |
| PUDONG, SHANGHAI, CHINA 201203 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 S. WACKER DRIVE |
| SUITE 3100 |
| CHICAGO, IL 60606 |
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