Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/31/2015
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Application #:
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13501746
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Filing Dt:
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04/12/2012
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Publication #:
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Pub Dt:
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04/04/2013
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Inventors:
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Masahiko Abe, Koji Watanabe, Masahiko Kanno, Hideaki Takahashi, Masaya Ito
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Title:
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SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| CHERNOFF VILHAUER MCCLUNG & STENZEL LLP |
| 601 SW 2ND AVE., STE. 1600 |
| PORTLAND, OR 97204 |
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