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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/06/2017
Application #:
13275423
Filing Dt:
10/18/2011
Publication #:
Pub Dt:
04/18/2013
Inventor:
Takukazu OTSUKA
Title:
SEMICONDUCTOR DEVICE WITH FLIP CHIP STRUCTURE AND FABRICATION METHOD OF THE SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
027452/0630Recorded: 12/28/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/10/2011
Assignee:
21, SAIIN MIZOSAKI-CHO, UKYO-KU
KYOTO-SHI, KYOTO-FU, JAPAN
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103

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