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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13275582
Filing Dt:
10/18/2011
Publication #:
Pub Dt:
04/18/2013
Inventors:
Sony Varghese, Sanh D. Tang
Title:
Methods Of Forming Circuit Structures Within Openings And Methods Of Forming Conductive Lines Across At Least A Portion Of A Substrate
Assignment: 1
Reel/Frame:
027077/0881Recorded: 10/18/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/13/2011
Exec Dt:
10/13/2011
Assignee:
8000 SOUTH FEDERAL WAY
MS 1-525
BOISE, IDAHO 83716
Correspondent:
WELLS ST. JOHN P.S.
601 W. 1ST AVENUE #1300
SPOKANE, WA 99201

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