Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13658180
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Filing Dt:
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10/23/2012
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Publication #:
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Pub Dt:
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05/02/2013
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Inventor:
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Akihiro Horibe
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Title:
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SOLDER BONDING PROCESS FORMING A SEMICONDUCTOR CHIP IN MULTIPLE STAGES ON A 3-DIMENSIONAL STACKED ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION IP LAW DEPARTMENT |
| 294 ROUTE 100 |
| P.O. BOX 100 |
| SOMERS, NY 10589-0100 |
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