Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2014
|
Application #:
|
13287826
|
Filing Dt:
|
11/02/2011
|
|
Publication #:
|
|
Pub Dt:
|
05/02/2013
| | | | |
|
Inventors:
|
Yaohuang Huang, Kah Wee Gan, Yonggang Jin
|
|
Title:
|
EMBEDDED WAFER LEVEL PACKAGE FOR 3D AND PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 28 ANG MO KIO, INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
|
|
|
|
| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
|
|
Search Results as of:
05/15/2024 06:22 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
