Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2014
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Application #:
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13287816
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Filing Dt:
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11/02/2011
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Publication #:
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Pub Dt:
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05/02/2013
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Inventors:
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Yonggang Jin, Jerome Teysseyre, Romain Coffy
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Title:
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Method of fabricating land grid array semiconductor package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO, INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| 12 RUE JULES HOROWITZ BP217 |
| GRENOBLE CEDEX, FRANCE 38019 |
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| HAROLD H. BENNETT II |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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