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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13534857
Filing Dt:
06/27/2012
Publication #:
Pub Dt:
05/09/2013
Inventor:
Seung Sang Lee
Title:
MOLD FOR HOT STAMPING
Assignment: 1
Reel/Frame:
028454/0786Recorded: 06/27/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/15/2012
Assignees:
231, YANGJAE-DONG, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF
231, YANGJAE-DONG, SEOCHO-GU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205
Assignment: 2
Reel/Frame:
028797/0332Recorded: 08/16/2012Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES FROM HYUNDAI MOTOR COMPANY AND KIA MOTORS CORPORATION TO HYUNDAI MOTOR COMPANY PREVIOUSLY RECORDED ON REEL 028454 FRAME 0786. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS' INTEREST..
Assignor:
Exec Dt:
06/15/2012
Assignee:
231, YANGJAE-DONG, SEOCHO-KU
SEOUL, KOREA, REPUBLIC OF
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205

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