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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
13701063
Filing Dt:
01/25/2013
Publication #:
Pub Dt:
05/09/2013
Inventors:
Hideki Matsumoto, Yoshihisa Muranushi, Masahiro Inuzuka
Title:
METHOD FOR ETCHING OF COPPER AND COPPER ALLOYS
Assignment: 1
Reel/Frame:
029690/0973Recorded: 01/25/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/24/2012
Exec Dt:
12/25/2012
Exec Dt:
12/25/2012
Assignee:
ERASMUSSTRASSE 20
BERLIN, GERMANY 10553
Correspondent:
RENNER, OTTO, BOISSELLE & SKLAR, LLP
1621 EUCLID AVENUE
19TH FLOOR
CLEVELAND, OH 44115
Assignment: 2
Reel/Frame:
041590/0001Recorded: 02/01/2017Pages: 57
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/31/2017
Exec Dt:
01/31/2017
Assignee:
745 7TH AVENUE
NEW YORK, NEW YORK 10019
Correspondent:
JAVIER J. RAMOS
1850 K STREET, NW, SUITE 1100
MILBANK, TWEED, HADLEY & MCCLOY, LLP
WASHINGTON, DC 20006
Assignment: 3
Reel/Frame:
055653/0714Recorded: 03/18/2021Pages: 53
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/18/2021
Assignees:
ERASMUSSTRASSE 20
BERLIN, GERMANY
1750 OVERVIEW DRIVE
ROCK HILL, SOUTH CAROLINA 29730
Correspondent:
MONICA ARNOLD, ESQ.
2029 CENTURY PARK EAST, 33RD FLOOR
MILBANK, LLP
LOS ANGELES, CA 90067

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