Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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13668988
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Filing Dt:
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11/05/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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Takuji SUKEKAWA, Noriyasu INOMATA, Hiroyuki YAMADA
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Title:
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REFLOW SOLDERING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 SHOWA-CHO KARIYA-CITY |
| AICHI-PREF., JAPAN 448-8661 |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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