Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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13261554
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Filing Dt:
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12/28/2012
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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Minoru Ueshima, Yoshimi Inagawa, Minoru Toyoda
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Title:
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BI-SN BASED HIGH-TEMPERATURE SOLDER ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K STREET NW |
| SUITE 300 |
| WASHINGTON, DC 20006 |
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