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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/05/2013
Application #:
13765337
Filing Dt:
02/12/2013
Publication #:
Pub Dt:
06/13/2013
Inventors:
Gang Ji, Tetsuya Ohtani, Takayuki Morino, Akinori Uchino
Title:
CASING STRUCTURE FOR ELECTRONIC DEVICES
Assignment: 1
Reel/Frame:
029799/0355Recorded: 02/12/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/08/2013
Exec Dt:
02/08/2013
Exec Dt:
02/12/2013
Exec Dt:
02/08/2013
Assignee:
151, LORONG CHUAN
#02-01, NEW TECH PARK
SINGAPORE, SINGAPORE 556741
Correspondent:
FERENCE & ASSOCIATES LLC
409 BROAD STREET
PITTSBURGH, PA 15143
Assignment: 2
Reel/Frame:
037211/0283Recorded: 12/04/2015Pages: 5
Conveyance:
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2014
Assignee:
23/F, LINCOLN HOUSE, 979 KING'S ROAD
QUARRY BAY, HONG KONG
Correspondent:
BECKY WILLIAMS
222 W. MERCHANDISE MART PLAZA
SUITE 1800
CHICAGO, IL 60654
Assignment: 3
Reel/Frame:
049678/0855Recorded: 07/03/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2014
Assignee:
23/F, LINCOLN HOUSE, 979 KING'S ROAD
QUARRY BAY, HONG KONG
Correspondent:
BECKY A. WILLIAMS
222 W. MERCHANDISE MART PLAZA
SUITE 1800
CHICAGO, IL 60654

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