Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13314684
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Filing Dt:
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12/08/2011
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Publication #:
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Pub Dt:
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06/13/2013
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Inventor:
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Chui Fu Chiu
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Title:
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WAFER SUPPORTING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD. |
| KUEISHAN, TAO-YUAN HSIEN, TAIWAN |
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| JUAN CARLOS A. MARQUEZ |
| 1199 N. FAIRFAX STREET, SUITE 900 |
| STITES & HARBISON PLLC |
| ALEXANDRIA, VA 22314 |
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