Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13713932
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Filing Dt:
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12/13/2012
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Wenqi Zhang, Eric Beyne, Wei-E Wang, Geert Eneman, Andrej Ivankovic
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Title:
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Method for Forming Isolation Trenches in Micro-Bump Interconnect Structures and Devices Obtained Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KAPELDREEF 75 |
| LEUVEN, BELGIUM 3001 |
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| WAAISTRAAT 6 |
| BOX 5105 |
| LEUVEN, BELGIUM 3000 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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