Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/25/2015
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Application #:
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13819038
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Filing Dt:
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02/26/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Takaaki Matsuoka, Toshihisa Nozawa, Toshiyasu Hori
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Title:
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ETCHING METHOD, SUBSTRATE PROCESSING METHOD, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 607 14TH STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 607 14TH STREET, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20005 |
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