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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/19/2016
Application #:
13689222
Filing Dt:
11/29/2012
Publication #:
Pub Dt:
06/27/2013
Inventors:
Shusaku TAGAMI, Yoshikazu MURAMATSU, Masanori MAEKAWA, Hideaki NAKAZAWA et al
Title:
METHOD FOR RESIN MOLDING AND RESIN MOLDING APPARATUS
Assignment: 1
Reel/Frame:
029382/0485Recorded: 11/30/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/12/2012
Exec Dt:
11/12/2012
Exec Dt:
11/12/2012
Exec Dt:
11/12/2012
Exec Dt:
11/12/2012
Exec Dt:
11/12/2012
Assignee:
90, OOAZA KAMITOKUMA
CHIKUMA-SHI, NAGANO, JAPAN 389-0898
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
P. O. BOX 747
FALLS CHURCH, VA 22040-0747

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