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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13339514
Filing Dt:
12/29/2011
Publication #:
20130168068
Pub Dt:
07/04/2013
Inventors:
Zhen Huang, Vinod Kamath, Howard V. Mahaney JR., Chunjian Ni, Mark E. Steinke et al
Title:
THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS
Assignment: 1
Reel/Frame:
027499/0527Recorded: 01/09/2012Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, ZHEN
Exec Dt:
12/21/2011
KAMATH, VINOD
Exec Dt:
12/21/2011
MAHANEY, HOWARD V., JR.
Exec Dt:
12/20/2011
NI, CHUNJIAN
Exec Dt:
12/20/2011
STEINKE, MARK E.
Exec Dt:
12/20/2011
WAKIL, JAMIL A.
Exec Dt:
12/21/2011
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
JEFFREY STREETS
13100 WORTHAM CENTER DR.
SUITE 245
HOUSTON, TX 77065
Assignment: 2
Reel/Frame:
034194/0111Recorded: 11/10/2014Pages: 32
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
09/26/2014
Assignee:
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
151 LORONG CHUAN
#02-01 NEW TECH PARK
SINGAPORE, SINGAPORE 556741
Correspondent:
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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