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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13703515
Filing Dt:
03/19/2013
Publication #:
Pub Dt:
07/04/2013
Inventors:
Nadia Frederich, José Gonzalez, Frédéric Raynal
Title:
COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITION
Assignment: 1
Reel/Frame:
030044/0749Recorded: 03/19/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/20/2013
Exec Dt:
01/31/2013
Exec Dt:
02/22/2013
Assignee:
15 RUE DU BUISSON AUX FRAISES, Z.I. DE LA BONDE
MASSY, FRANCE 91300
Correspondent:
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
P.O. BOX 2902
MINNEAPOLIS, MN 55402

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