Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2014
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Application #:
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13342226
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Filing Dt:
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01/03/2012
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Publication #:
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Pub Dt:
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07/04/2013
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Inventors:
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Xiaojun Yu, Anda C. Mocuta, Toshiaki Kirihata
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Title:
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Intra Die Variation Monitor Using Through-Silicon Via
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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INTERNATIONAL BUSINESS MACHINES CORP. |
2070 ROUTE 52 |
M/D 0482 |
HOPEWELL JUNCTION, NY 12533 |
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