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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/27/2015
Application #:
13341890
Filing Dt:
12/30/2011
Publication #:
Pub Dt:
07/04/2013
Inventors:
KahWee GAN, Yaohuang HUANG
Title:
CIRCUIT MODULE WITH MULTIPLE SUBMODULES
Assignment: 1
Reel/Frame:
027468/0651Recorded: 01/03/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/20/2011
Exec Dt:
12/20/2011
Assignee:
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
GRAYBEAL JACKSON LLP
400 - 108TH AVENUE NE, SUITE 700
BELLEVUE, WA 98004

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